Cleaning of Bondwires with Superior Efficiency

High-power ultrasound is highly efficient in removing oxide layers from bondwires. Hielscher ultrasonic wire cleaners remove any contamination and residues from the surface of the bonding wires without mechanical or chemical treatment of sensitive wire structures.

Intense yet Gentle Cleaning of Bondwires with Ultrasound

Hielscher ultrasonic inline cleaners are used for efficient, yet gentle cleaning of bondwires. Bonding wires are very fine wires used as interconnects.Ultrasonic inline cleaners are the most effective and gentle method for removing unwanted substances from bonding wires. Since diameters of bondwires start from under 10 μm and can be up to several hundred micrometres (e.g., for high-powered applications), the cleaning treatment of such delicate wires must be gentle, yet effective. Intense ultrasound waves are a proven way to remove oxide layers and other contaminations from wires such as aluminum, copper, silvers, or gold bondwires. As ultrasonic inline cleaners do not apply mechanical or chemical forces such as brushes or harsh cleaning agents, the metallic wire structure remains undamaged. Only unwanted layers of oxides, dust and processing residues are removed.

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Ultrasonic processor with inline wire cleaning sonotrode for the efficient cleaning of endless profiles.

Ultrasonic processor with inline wire cleaning sonotrode for the efficient cleaning of bonding wires.

Working Principle of Ultrasonic Inline Bondwire Cleaners

Hielscher ultrasonic inline cleaners are widely used in the production of wires, cables and other endless materials in order to remove dust, dirt, soaps and processing residues.
Using innovative proprietary ultrasonic technology, Hielscher ultrasonic inline cleaning systems create an intense cavitation field, so that very efficacious cleaning results are accomplished. As the cleaning effect is based on the physical cleaning effects of ultrasound waves, it can be used for any ferrous and non-ferrous material. As the ultrasonic power is applied focused to a low liquid volume, intense cleaning effects are achieved whilst saving time, energy, and cleaning agents. At the same time, this use of focused ultrasound allows to realize a very compact design of the ultrasonic cleaning unit. Installations into new production lines as well as retro-fitting into existing production facilities are easily realized.

Ultrasonic inline wire cleaning systems from Hielscher Ultrasonics achieve superior cleaning effects. The video demonstrates the compact ultrasonic inline wire cleaning system WTC950.

Compact Ultrasonic Inline Wire Cleaning System WTC950

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Ultrasonic Cleaning

  • efficient removal oxide layers and dirt
  • gentle & non-damaging: excellent for sensitive and thin materials
  • bondwires of various diameters
  • individual line speeds
  • time- and energy-saving
  • safe and simple to operate
  • easy installation, low maintenance
  • environmental-friendly

Why Does Ultrasonic Inline Cleaning Excel Other Wire Cleaning Methods?

Hielscher Ultrasonics is long-time experienced in high-power ultrasound systems. Powerful ultrasound generators and transducers generate intense oscillations at frequencies of approx. 20kHz. When such ultrasound waves are transmitted into a liquid, e.g. water, cleaning agent, acoustic cavitation occurs. Cavitation is an effect that is generated in liquids as result of alternating high-pressure / low-pressure cycles, which occur when ultrasound waves travel through a liquid. The resulting pressure waves create vacuum bubbles, that implode subsequently. As a result of these implosions, very high pressures and temperatures occur in combination with liquid jets of up to 1000km/h. At surfaces, these mechanical forces loosen impurities, so they can be flushed away with the cleaning liquid. For an intensive cavitation – and by that for an intensive cleaning – high amplitudes and a low ultrasonic frequency (approx. 20kHz) are needed.
Hielscher Ultrasonics offers various ultrasonic inline cleaning systems with matching sonotrodes, which can be precisely adapted to your endless material and specific cleanliness requirements.

Highly focused ultrasound waves remove dirt, dust, soaps and process residuals from endless profiles such as wires, cables, rods, fibres, stamped belts and metallic profiles.

Highly focused ultrasound waves remove dirt, dust, soaps and process residuals from endless profiles such as wires, cables, rods, fibres, stamped belts and metallic profiles.

Learn more about ultrasonic bondwire drawing!

Common bondwire materials are smoothly drawn to ultra-thin wires

  • Aluminum
  • Copper
  • Silver
  • Gold

High-Performance Ultrasonic Inline Cleaners for Bondwires

Highly focused ultrasound waves allow for excellent cleaning results during ultrasonic inline wire cleaning using Hielscher Ultrasonics systems.Hielscher Ultrasonics offers numerous ultrasonic inline cleaning systems for the continuous cleaning of endless materials such as wires and very thin bondwires. The ultrasonic amplitude is the main process parameter, which determines the cleaning results. Since Hielscher Ultrasonic wire cleaners allow full control over the amplitude, a gentle yet highly efficient cleaning can be reliably achieved. This is especially important when it comes to bondwires with ultra-thin diameters. Adjusting the amplitude allows to achieve optimum cleanliness under mild, non-damaging conditions.
Since Hielscher inline ultrasound cleaners are very energy-efficient and can be operated without or with only very small amounts of cleaning agents, the installation will amortizise itself within months. Furthermore, ultrasonic bondwire cleaning is cost-efficient, safe and simple to operate as well as environmental-friendly. With outstanding robustness, the maintenance of Hielscher ultrasonicators is almost neglectable.
Contact us know to learn more about ultrasonic bondwire cleaning and specific technical details of our ultrasonic inline cleaners!

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Please use the form below to request additional information about ultrasonic processors, applications and price. We will be glad to discuss your process with you and to offer you an ultrasonic system meeting your requirements!

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In this video the ultrasonic inline cleaning system USCM2000 is presented. This ultrasonic inline cleaner is ideal for the removal of drawing lubricant or stearate from wire surfaces, of punching dust from strips and for the cleaning of diverse profiles, threaded spindles, bars and other stranded products.

Ultrasonic Inline Cleaning System USCM2000 for Wire, Tube or Profiles

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Literature / References

Facts Worth Knowing

Wire Bonding

Wire bonding describes the method of creating interconnects (interconnections) between an integrated circuit (IC) or other semiconductor devices and its packaging during the manufacturing process. Wire bonding is an alternative to soldering or high-performance adhesives, namely electrically conductive adhesives (ECAs) (isotropically conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs)). Since wire bonding is most cost-effective and flexible when various interconnect technologies are compared, it is used to assemble the vast majority of semiconductor packages.

High performance ultrasonics! Hielscher's product range covers the full spectrum from the compact lab ultrasonicator over bench-top units to full-industrial ultrasonic systems.

Hielscher Ultrasonics manufactures high-performance ultrasonic homogenizers from lab to industrial size.

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