Cleaning of Bondwires with Superior Efficiency
High-power ultrasound is highly efficient in removing oxide layers from bondwires. Hielscher ultrasonic wire cleaners remove any contamination and residues from the surface of the bonding wires without mechanical or chemical treatment of sensitive wire structures.
Intense yet Gentle Cleaning of Bondwires with Ultrasound
Ultrasonic inline cleaners are the most effective and gentle method for removing unwanted substances from bonding wires. Since diameters of bondwires start from under 10 μm and can be up to several hundred micrometres (e.g., for high-powered applications), the cleaning treatment of such delicate wires must be gentle, yet effective. Intense ultrasound waves are a proven way to remove oxide layers and other contaminations from wires such as aluminum, copper, silvers, or gold bondwires. As ultrasonic inline cleaners do not apply mechanical or chemical forces such as brushes or harsh cleaning agents, the metallic wire structure remains undamaged. Only unwanted layers of oxides, dust and processing residues are removed.
Working Principle of Ultrasonic Inline Bondwire Cleaners
Hielscher ultrasonic inline cleaners are widely used in the production of wires, cables and other endless materials in order to remove dust, dirt, soaps and processing residues.
Using innovative proprietary ultrasonic technology, Hielscher ultrasonic inline cleaning systems create an intense cavitation field, so that very efficacious cleaning results are accomplished. As the cleaning effect is based on the physical cleaning effects of ultrasound waves, it can be used for any ferrous and non-ferrous material. As the ultrasonic power is applied focused to a low liquid volume, intense cleaning effects are achieved whilst saving time, energy, and cleaning agents. At the same time, this use of focused ultrasound allows to realize a very compact design of the ultrasonic cleaning unit. Installations into new production lines as well as retro-fitting into existing production facilities are easily realized.
- efficient removal oxide layers and dirt
- gentle & non-damaging: excellent for sensitive and thin materials
- bondwires of various diameters
- individual line speeds
- time- and energy-saving
- safe and simple to operate
- easy installation, low maintenance
- environmental-friendly
Why Does Ultrasonic Inline Cleaning Excel Other Wire Cleaning Methods?
Hielscher Ultrasonics is long-time experienced in high-power ultrasound systems. Powerful ultrasound generators and transducers generate intense oscillations at frequencies of approx. 20kHz. When such ultrasound waves are transmitted into a liquid, e.g. water, cleaning agent, acoustic cavitation occurs. Cavitation is an effect that is generated in liquids as result of alternating high-pressure / low-pressure cycles, which occur when ultrasound waves travel through a liquid. The resulting pressure waves create vacuum bubbles, that implode subsequently. As a result of these implosions, very high pressures and temperatures occur in combination with liquid jets of up to 1000km/h. At surfaces, these mechanical forces loosen impurities, so they can be flushed away with the cleaning liquid. For an intensive cavitation – and by that for an intensive cleaning – high amplitudes and a low ultrasonic frequency (approx. 20kHz) are needed.
Hielscher Ultrasonics offers various ultrasonic inline cleaning systems with matching sonotrodes, which can be precisely adapted to your endless material and specific cleanliness requirements.

Highly focused ultrasound waves remove dirt, dust, soaps and process residuals from endless profiles such as wires, cables, rods, fibres, stamped belts and metallic profiles.
Common bondwire materials are smoothly drawn to ultra-thin wires
- Aluminum
- Copper
- Silver
- Gold
High-Performance Ultrasonic Inline Cleaners for Bondwires
Hielscher Ultrasonics offers numerous ultrasonic inline cleaning systems for the continuous cleaning of endless materials such as wires and very thin bondwires. The ultrasonic amplitude is the main process parameter, which determines the cleaning results. Since Hielscher Ultrasonic wire cleaners allow full control over the amplitude, a gentle yet highly efficient cleaning can be reliably achieved. This is especially important when it comes to bondwires with ultra-thin diameters. Adjusting the amplitude allows to achieve optimum cleanliness under mild, non-damaging conditions.
Since Hielscher inline ultrasound cleaners are very energy-efficient and can be operated without or with only very small amounts of cleaning agents, the installation will amortizise itself within months. Furthermore, ultrasonic bondwire cleaning is cost-efficient, safe and simple to operate as well as environmetal-friendly. With outstanding robustness, the maintenance of Hielscher ultrasonicators is almost neglectable.
Contact us know to learn more about ultrasonic bondwire cleaning and specific technical details of our ultrasonic inline cleaners!
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Literature / References
- Leighton, Timothy; Birkin, Peter; Offin, Doug (2013): A new approach to ultrasonic cleaning. International Congress on Acoustics, January 2013.
- Fuchs, John F. (2002): Ultrasonic Cleaning: Fundamental Theory and Applications. In: Proceedings of Precision Cleaning May 15-17, 1995, Rosemont, IL, USA.
Facts Worth Knowing
Wire Bonding
Wire bonding describes the method of creating interconnects (interconnections) between an integrated circuit (IC) or other semiconductor devices and its packaging during the manufacturing process. Wire bonding is an alternative to soldering or high-performance adhesives, namely electrically conductive adhesives (ECAs) (isotropically conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs)). Since wire bonding is most cost-effective and flexible when various interconnect technologies are compared, it is used to assemble the vast majority of semiconductor packages.

Hielscher Ultrasonics manufactures high-performance ultrasonic homogenizers from lab to industrial size.