I-Hielscher Ultrasound Technology

Ukusabalalisa kwe-Ultrasonic ye-Polishing Agents (CMP)

  • Usayizi wezinhlayiyana ongafani nobuningi bokusabalalisa usayizi wezinhlayiyana kubangela ukulimala okukhulu endaweni epholile ngesikhathi senqubo ye-CMP.
  • Ukusabalalisa kwe-Ultrasonic kuyindlela ephakeme yokusabalalisa nokuhlukanisa izinhlayiyana zokupunga ezincane.
  • Ukusabalalisa komfaniswano okwenziwe yi-sonication kubangelwa ukucubungula okuphezulu kwe-CMP ukugwema ukukhwabanisa neziphambeko ngenxa yamabele okusanhlamvu.

 

Ukusabalalisa kwe-Ultrasonic yePolishing Particles

Ama-nano-particles asetshenziselwa ukuhlukumeza ahlanganisa i-silicum dioxide (i-silica, i-SiO2), cerium oxide (ceria, CeO2), aluminium oxide (alumina, Al2O3), α- no-y-Fe203, ama-nanodiamond phakathi kwabanye. Ukuze ugweme ukulimala endaweni ephosiwe, izinhlayiya ezilahlayo kufanele zibe nomumo ofanayo kanye nokusabalalisa okusayizi okusanhlamvu okusanhlamvu. Ubukhulu bezinhlayiyana eziphakathi kwezinhlayiyana eziphakathi kuka-10 no-100 nanometers, kuye ngokuthi ukwakheka kwe-CMP nokusetshenziswa kwayo.
Ukuhlakazeka kwe-Ultrasonic kwaziwa kakhulu ukukhiqiza umfaniswano, ukusabalalisa isikhathi eside isikhathi eside. I-Ultrasonic cavitation futhi ubophe amabutho umbhangqwana amandla adingekayo ekumiswe ukuze ama-agglomerate aphulwe, vimba ama-Waals amabutho anqobe futhi ama-nanoparticles abrasive asakazwa ngokufanayo. Nge sonication kungenzeka ukunciphisa usayizi wezinhlayiyana ngokuqondile usayizi okusanhlamvu okusanhlamvu. Ngokusetshenziselwa ukufana kwe-ultrasonic ye-slurry, okusanhlamvu okungaphezu kwamandla nokusabalalisa usayizi ongalingani kungaqedwa – ukuqinisekisa izinga lokususwa kwe-CMP ngenkathi kunciphisa okwenzeka emanxebeni.

Ukuhlakazeka kwe-Ultrasonic kwe-Fied Silica: I-Hielscher ultrason homogenizer UP400S isabalalisa i-silica powder ngokushesha futhi kahle zibe zinhlayiya ezingama-nano eyodwa.

Ihlakaza i-Silisia eManzini isebenzisa i-UP400S

Isicelo solwazi




Qaphela kwethu Inqubomgomo yobumfihlo.


Imiphumela ye-Ultrasonic ehlakazeka emgqeni wezinhlayiyana ezincane kakhulu.

I-sonication yangaphambi nangemva: I-curve eluhlaza ibonisa ubukhulu bezinhlayiyana ngaphambi kwe-sonication, i-curve ebomvu ukusabalalisa usayizi wezinhlayiyana ze-silika e-ultrasonically ehlakazekile.

IzinzuzoI-nano-silica ehlakazeka nge-Ultrasonically (Chofoza ukuze ukhulise!)

  • usayizi wezinhlayiyana ezihlosiwe
  • ukufana okuphezulu
  • ukuhlushwa okuphansi kuya phezulu
  • ukuthembeka okuphezulu
  • ukulawula okuqondile
  • ukukhiqiza kabusha okuqondile
  • i-linear, i-seamless scale-up

I-ultrasonic yokwenza i-CMP

Ukuhlanganiswa kwe-ultrasonic nokuxuba kusetshenziselwa izimboni eziningi ukukhiqiza ukumiswa okwakhayo nge-viscosities ephansi kakhulu. Ukuze ukhiqize ama-slurries e-uniform futhi azinzile, izinto zokwehla (isib. Silika, ceria nanoparticles, α- and y-Fe203 njll), izithasiselo namakhemikhali (isib. izinto zokwakheka kwe-alkaline, i-rust inhibitors, i-stabilizers) zihlakazeka emzimbeni wamanzi (isib. amanzi ahlanzekile).
Ngokuphathelene nekhwalithi, ukukhwabanisa okuphezulu kokusebenza kwe-slurries kuqakathekile ukuthi ukumiswa kubonisa ukuzinza kwesikhathi eside kanye nokusabalalisa okulinganayo kwezinhlayiyana.
Ukuhlakazeka kwe-Ultrasonic nokuklama kuhambisa amandla adingekayo ukuze agcwalise futhi asakaze ama-agent abamba ukupholisa. Ukulawulwa okucacile kwemingcele yokucubungula i-ultrasonic kunikeza imiphumela emihle ekusebenzeni okuphezulu nokuthembeka.

I-sonication enamandla ihlakaza ama-nanoparticles ahlukumezayo abe yi-CMP slurries.

I-industrial ultrasonic disperser UIP1500hdT

Izinhlelo ze-Ultrasonic Dispersing

I-Hielscher Ultrasonics inikela ngezinhlelo eziphezulu zamandla e-Ultrason zokuhlakazeka kwezinto ezisetshenziswa ngosayizi we-nano ezifana ne-silica, ceria, alumina ne-nanodiamonds. Amaprosesa athembekile we-ultrasonic aletha amandla adingekayo, ama-metabolic ahambisanayo e-ultrasonic enza izimo ezinhle zenqubo futhi opharetha banokulawula okuqondile kuwo wonke amapharamitha, ukuze imiphumela yenqubo ye-ultrasonic ingafakwa ngqo kumigomo yenqubo oyifunayo (njengosayizi wokusanhlamvu, ukusatshalaliswa kwezinhlayiyana njll. ).
Enye yezinqubo ezibaluleke kunazo zonke yi-amplitude ye-ultrasonic. Hielscher's izinhlelo ze-industrial ultrasonic kungaba ngokukhululeka ukuletha ama-amplitudes aphakeme kakhulu. Amplitudes angafika ku-200μm angaqhutshwa ngokuqhubekayo ku-24/7 ukusebenza. Ikhono lokusebenzisa ama-amplitudes anjalo aqinisekisayo ukuthi imigomo yenqubo efuna kakhulu ingafinyelelwa. Zonke izinqubo ze-ultrasonic zethu zingahle zilungiswe kahle ezimweni ezidingekayo zenqubo futhi zihlolwe kalula nge-software eyakhelwe ngaphakathi. Lokhu kuqinisekisa ukuthembeka okuphakeme kakhulu, ikhwalithi ehambisanayo kanye nemiphumela ephindaphindiwe. Ukuqina kwemishini ye-ultrasonic ye-Hielscher kuvumela ukusebenza komsebenzi we-24/7 emsebenzini obuthakathaka nasezindaweni ezinzima.

Xhumana nathi! / Cela Us!

Sicela usebenzise ifomu elingezansi, uma ufisa ukucela ulwazi oluthe xaxa mayelana ne-homogenization yama-ultrasonic. Sizojabula ukukunikeza uhlelo lwe-ultrasonic ukuhlangabezana nezidingo zakho.









Sicela uqaphele wethu Inqubomgomo yobumfihlo.




Amaqiniso Okufanele Ukwazi

I-Platinum Mechanical Planarization (CMP)

Ama-slurries asetshenziswe ngamakhemikhali / ama-planarization (CMP) asetshenziselwa ukushisa. I-CMP slurry iqukethe izingxenye zamakhemikhali nezinsimbi ezithintekayo. Ngaleyo ndlela, i-CMP ingachazwa njengendlela ehlanganisiwe yokumakhemikhali yamakhemikhali kanye nokupholisa okumnyama.
Ukumiswa kwe-CMP kusetshenziselwa ukupholisa nokushisa i-silicon oxide, i-poly silicon nezinsimbi zensimbi. Ngenkathi yenqubo ye-CMP, indawo yesimo sendawo isuswe endaweni yokugcina (isb. Semiconductors, i-wafers solar, izingxenye zamadivayisi kagesi).

Ama-surfactants

Ukuze uthole ukubunjwa kwe-CMP esesigxile isikhathi eside, ama-surfactants ayengeziwe ukugcina ama-nanoparticles ekumiswe okwesikhashana. Amakhemikhali asetshenziselwa ukuhlakazeka ngokuvamile angaba cationic, anionic, noma nonionic futhi afaka i-sodium dodecyl sulfate (SDS), i-cetyl pyridinium chloride (CPC), usawoti we-sodium we-capric acid, usawoti we-sodium we-lauric acid, i-sodium sulfate encane, i-hexadecyl sodium sulfate, i-hexadecyltrimethylammonium bromide (C16TAB), i-dodecyltrimethylammonium bromide (C12TAB), Triton X-100, Tween 20, Tween 40, Tween 60, Tween 80, Symperonic A4, A7, A11 no-A20.